Publications

H. He*, C. Han*, H. Chae*, L. Xia, Q. Zhou, L. Liu, S. Li, D. Z. Pan, and T. Chi, “FoundaRF: A Physics-Informed Foundation Model Framework for Radio-Frequency Passive Components,” in Proc. IEEE/ACM Int. Conf. Comput.-Aided Design (ICCAD), Nov. 2026. (* Equally credited authors)

Y. Fan, Y. Ma, P. Zolotavin, G. Topalli, W. Wang, M. Karlsson, M. Karlsson, L. Luan, C. Xie, and T. Chi, “High-Channel-Count Neural Recording and Stimulation Platform with 5,376 Simultaneous Recording Channels,” npj Biomed. Innov., vol. 3, Aug. 2026.

T. Chi, Q. Zhou, H. Guo, and X. Zhang, “Doherty Power Amplifiers: Fundamentals and Recent Advances,” IEEE Solid-State Circuits Mag. (SSC-M), vol. 18, no. 3, pp. 44–54, Summer 2026.

Y. Xing, H. He, J. Wang, E. Ni, S. Wang, Q. Li, W. Cao, and T. Chi, “RF-Agent: A Practical Framework for Building Language Agents for RFIC Design,” in Proc. IEEE Int. Conf. LLM-Aided Design (ICLAD), Jul. 2026.

Q. Zhou, Y. Su, H. Guo, Y. Hu, K. Yang, and T. Chi, “A 28GHz Frequency-Diverse Sub-Array TX with Secret Phase Keys and Antenna Subset Modulation for Eavesdropping-Resilient Wireless Communication,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2026, pp. 92–93.

L. Liu, Y. Fang, Q. Zhou, T. Chi, and S. Li, “A mm-Wave Doherty Power Amplifier in a Single-Path Footprint Using Compact Reciprocal Doherty Networks,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2026, pp. 344–345.

H. He*, Y. Xu*, L. Xia, Y. Hu, F. Cai, and T. Chi, “MOTIF-RF: Multi-template On-chip Transformer Synthesis Incorporating Frequency-domain Self-transfer Learning for RFIC Design Automation,” in Proc. Asia South Pacific Design Autom. Conf. (ASP-DAC), Jan. 2026, pp. 1138–1144. (* Equally credited author)

H. Guo and T. Chi, “Design and Analysis of a W-band Local Oscillator Generator With Cascaded Implicit Frequency Quintupling and Tripling,” IEEE Trans. Microw. Theory Techn. (T-MTT), vol. 73, no. 11, pp. 9616–9631, Nov. 2025.

S. Wang, Q. Li, H. He, J. Gao, Z. Wang, Y. Sun, X. Zhang, T. Chi, and W. Cao, “Invited Paper: Multi-Agent Generative Synthesis for Analog/RF Circuit: from Scalable Topology Generation to Efficient Inverse Design,” in Proc. IEEE/ACM Int. Conf. Comput.-Aided Design (ICCAD), Oct. 2025.

Q. Zhou, Y. He, Y. Hu, X. Zhang, K. Yang, and T. Chi, “A Millimeter-Wave Antenna Subset Modulation Transmitter Array for Low-Overhead Physical-Layer Security Against Wireless Eavesdropping Attacks,” IEEE Trans. Microw. Theory Techn. (T-MTT), vol. 73, no. 6, pp. 3630–3643, Jun. 2025.

Y. Hu, H. Guo, S. Wang, J. Liu, W. Cao, and T. Chi, “AdreamDCO: AI-Driven Robust and Efficient Design Automation for Digitally Controlled Oscillators,” in Proc. ACM/IEEE Design Autom. Conf. (DAC), Jun. 2025.

S. Wang, Y. Hu, Z. Yi, T. Chi, and W. Cao, “Late Breaking Results: Opera: An Open and Efficient Platform for Data-driven Synthesis of Analog Circuits,” in Proc. ACM/IEEE Design Autom. Conf. (DAC), Jun. 2025.

H. Wang*, H. Guo*, X. Zhang*, and T. Chi, “A Packaged D-band Transmitter with a Multifeed Lens Antenna Achieving 25.3dBm Single-element EIRP for 2-D Scalable Arrays,” in Proc. IEEE Custom Integr. Circuits Conf. (CICC), Apr. 2025. (* Equally credited author)

X. Zhang*, R. Wang*, Q. Zhou*, H. Guo, C. Shi, and T. Chi, “A 24-to-29GHz Compact Transmit/Receive Front-end Module Featuring an Asymmetric Doherty Power Amplifier and 0.22mm² Area,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2025, pp. 464–465. (* Equally credited author)

H. Guo, Y. Hu, and T. Chi, “A 9.05-to-37.0GHz LO Generator with Magnetic Mode Switching and Tuning-Free Octave-Bandwidth Common-Mode Resonator Achieving >190.7dBc/Hz FoM,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2025, pp. 560–561. ― 2025 ISSCC Lewis Winner Outstanding Paper Award

H. Chae, S. H. Chai, T. Chi, S. Li, and D. Z. Pan, “ML-Assisted RF IC Design Enablement: the New Frontier of AI for EDA,” in Proc. Asia South Pacific Design Autom. Conf. (ASP-DAC), Jan. 2025, pp. 683–689. ― Invited Paper

G. Topalli, Y. Fan, M. Y. Cheung, A. Veeraraghavan, M. Hirzallah, and T. Chi, “An Ultrasonic Transceiver for Non-Invasive Intracranial Pressure Sensing,” IEEE Trans. Biomed. Circuits Syst. (T-BioCAS), vol. 18, no. 6, pp. 1220–1232, Dec. 2024.

X. Zhang, H. Guo, and T. Chi, “A Millimeter-Wave Four-Way Doherty Power Amplifier with Over-GHz Modulation Bandwidth,” IEEE J. Solid-State Circuits (JSSC), vol. 59, no. 12, pp. 3898–3914, Dec. 2024.

Y. Hu, X. Zhang, and T. Chi, “A 28-GHz Hybrid Beamforming Transmitter With Spatial Notch Steering Enabling Concurrent Dual Data Streams for 5G MIMO Applications,” IEEE J. Solid-State Circuits (JSSC), vol. 59, no. 10, pp. 3378–3391, Oct. 2024.

T. Chi, Y. Hu, X. Zhang, and H. Guo, “Pushing the Performance Boundaries of MmWave and Sub-THz Transceiver Circuits Through Passive Network Design Innovations,” in Proc. IEEE Int. Midwest Symp. Circuits Syst. (MWSCAS), Aug. 2024, pp. 759–763. ― Invited Paper

Y. Hu, X. Zhang, Q. Zhou, F. Cai, C. Cui, and T. Chi, “Automated mmWave Power Amplifier Design Flow and a 28-GHz Design Example in 45-nm CMOS SOI,” in Proc. IEEE MTT-S Int. Microw. Symp. (IMS), Jun. 2024, pp. 842–845. ― 2024 IMS Advanced Practice Paper Award Finalist

Q. Rui, N. Elzner, Q. Zhou, Z. Wen, Y. He, K. Yang, and T. Chi, “Lightweight Machine Learning and Embedded Security Engine for Physical-Layer Identification of Wireless IoT Nodes,” in Proc. IEEE Int. Conf. Commun. (ICC), Jun. 2024, pp. 2865–2870.

X. Zhang, S. Li, and T. Chi, “A Millimeter-Wave Watt-Level Doherty Power Amplifier in Silicon,” IEEE Trans. Microw. Theory Techn. (T-MTT), vol. 72, no. 3, pp. 1674–1686, Mar. 2024.

Q. Zhou, Y. He, K. Yang, and T. Chi, “Physical-Layer Identification of Wireless IoT Nodes Through PUF-Controlled Transmitter Spectral Regrowth,” IEEE Trans. Microw. Theory Techn. (T-MTT), vol. 72, no. 2, pp. 1045–1055, Feb. 2024.

X. Zhang*, H. Guo*, and T. Chi, “A 47GHz 4-way Doherty PA with 23.7dBm P1dB and 21.7% / 13.1% PAE at 6 / 12dB Back-off Supporting 2000MHz 5G NR 64-QAM OFDM,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2024, pp. 520–521. (* Equally credited author) ― 2024 ISSCC Lewis Winner Outstanding Paper Award

G. Topalli, Y. Fan, M. Y. Cheung, A. Veeraraghavan, M. Hirzallah, and T. Chi, “A 9mW Ultrasonic Through Transmission Transceiver for Non-Invasive Intracranial Pressure Sensing,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2024, pp. 334–335.

Y. Fan*, Y. Liu*, G. Topalli, R. Lycke, L. Luan, C. Xie, and T. Chi, “A 24V Mini-Coil Magnetic Neural Stimulator with Closed-Loop Deadtime Control and ZCS Control Achieving 99.76% Charge Recovery Efficiency,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2024, pp. 322–323. (* Equally credited author)

G. Topalli, Y. Fan, R. Yin, C. Xie, L. Luan, and T. Chi, “A Complementary Pseudo-Resistor with Leakage Current Self-Compensation for Biopotential Amplifiers,” in Proc. IEEE Biomed. Circuits Syst. Conf. (BioCAS), Oct. 2023.

Y. Hu and T. Chi, “A 27.5–46.2-GHz Broadband Low Noise Amplifier With IP3 Enhancement,” IEEE Microw. Wireless Technol. Lett. (MWTL), vol. 33, no. 9, pp. 1293–1296, Sep. 2023.

S. Dong, N. Sharma, S. Li, M. Chen, X. Zhang, Y. Hu, J. Li, Y. Su, X. Xu, V. Loseu, E. Seok, T. Chi, W.-S. Choi, and G. Xu, “A 140GHz RF Beamforming Phased-Array Receiver Supporting >20dB IRR with 8GHz Channel Bandwidth at Low IF in 22nm FDSOI CMOS,” in Proc. IEEE Radio Freq. Integr. Circuits Symp. (RFIC), Jun. 2023, pp. 293–296. ― 2023 IEEE RFIC Industry Paper Award Finalist

X. Zhang, S. Li, D. Huang, and T. Chi, “A Millimeter-Wave Three-Way Doherty Power Amplifier for 5G NR OFDM,” IEEE J. Solid-State Circuits (JSSC), vol. 58, no. 5, pp. 1256–1270, May 2023.

Y. Hu and T. Chi, “A Systematic Approach to Designing Broadband Millimeter-Wave Cascode Common-Source With Inductive Degeneration Low Noise Amplifiers,” IEEE Trans. Circuits Syst. I, Reg. Papers (TCAS-I), vol. 70, no. 4, pp. 1489–1502, Apr. 2023.

H. Guo and T. Chi, “An 86.5-105.6GHz LO Generator with Cascaded Implicit Frequency Quintupling and Tripling Achieving -107.7dBc/Hz Phase Noise and 191.2dBc/Hz FoM at 1MHz Offset,” in Proc. IEEE Custom Integr. Circuits Conf. (CICC), Apr. 2023.

X. Zhang, S. Li, and T. Chi, “A 38GHz Power-Combined Doherty PA Based on an Extended Rat-Race Coupler Achieving 27.5dBm Saturated Power and 15.0% Efficiency at 6dB Back-Off,” in Proc. IEEE Custom Integr. Circuits Conf. (CICC), Apr. 2023.

J. Tomkiewicz, Q. Zhou, and T. Chi, “An Efficient Mulitfeed Rectenna For RF Energy Harvesting,” in Proc. IEEE Texas Symp. Wireless Microw. Circuits Syst. (WMCS), Apr. 2023.

F. Ahsan, T. Chi, R. Cho, S. A. Sheth, W. Goodman, and B. Aazhang, “EMvelop Stimulation: Minimally Invasive Deep Brain Stimulation Using Temporally Interfering Electromagnetic Waves,” J. Neural Eng., vol. 19, no. 4, Aug. 2022.

X. Zhang, S. Li, D. Huang, and T. Chi, “A 38GHz Deep Back-Off Efficiency Enhancement PA with Three-Way Doherty Network Synthesis Achieving 11.3dBm Average Output Power and 14.7% Average Efficiency for 5G NR OFDM,” in Proc. IEEE Radio Freq. Integr. Circuits Symp. (RFIC), Jun. 2022, pp. 239–242. ― 2022 IEEE RFIC Best Student Paper Award Finalist

Y. Fan, L. Zhang, Q. Zhang, G. Bao, and T. Chi, “An Integrated Microheater Array With Closed-Loop Temperature Regulation Based on Ferromagnetic Resonance of Magnetic Nanoparticles,” IEEE Trans. Biomed. Circuits Syst. (T-BioCAS), vol. 15, no. 6, pp. 1236–1249, Dec. 2021.

W. Schmid, Y. Fan, T. Chi, E. Golanov, A. S. Regnier-Golanov, R. J. Austerman, K. Podell, P. Cherukuri, T. Bentley, C. T. Steele, S. Schodrof, B. Aazhang, and G. W. Britz, “Review of Wearable Technologies and Machine Learning Methodologies for Systematic Detection of Mild Traumatic Brain Injuries,” J. Neural Eng., vol. 18, no. 4, Aug. 2021.

Y. Hu and T. Chi, “A 27–46-GHz Low Noise Amplifier With Dual-Resonant Input Matching and A Transformer-Based Broadband Output Network,” IEEE Microw. Wireless Compon. Lett. (MWCL), vol. 31, no. 6, pp. 725–728, Jun. 2021. ― Special Issue of Top IMS2021 Papers, IMS Advanced Practice Paper Finalist

Y. Hu*, X. Zhang*, and T. Chi, “A 28GHz Hybrid-Beamforming Transmitter Array Supporting Concurrent Dual Data Steams and Spatial Notch Steering for 5G MIMO,” in Proc. IEEE Custom Integr. Circuits Conf. (CICC), Apr. 2021. (* Equally credited author) ― 2021 IEEE CICC Best Student Paper Award

Y. Fan, L. Zhang, Q. Zhang, G. Bao, and T. Chi, “An Integrated Thermal Actuation/Sensing Array with Stacked Oscillators for Efficient and Localized Heating of Magnetic Nanoparticles with Sub-Millimeter Spatial Resolution,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2021, pp. 280–281.

Q. Zhou*, Y. He*, K. Yang, and T. Chi, “Exploring PUF-Controlled PA Spectral Regrowth for Physical-Layer Identification of IoT Nodes,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2021, pp. 204–205. (* Equally credited author)

S. Li, T. Chi, and H. Wang, “Multi-Feed Antenna and Electronics Co-Design: An E-Band Antenna-LNA Front End With On-Antenna Noise-Canceling and Gₘ-Boosting,” IEEE J. Solid-State Circuits (JSSC), vol. 55, no. 12, pp. 3362–3375, Dec. 2020.

F. Ahsan, T. Chi, R. Cho, S. A. Sheth, W. Goodman, and B. Aazhang, “Non-invasive Deep Brain Stimulation using Electromagnetic Waves,” in Proc. Asilomar Conf. Signals, Syst., Comput., Nov. 2020, pp. 813–817.

L. Luan, J. T. Robinson, B. Aazhang, T. Chi, K. Yang, X. Li, H. Rathore, A. Singer, S. Yellapantula, Y. Fan, Z. Yu, and C. Xie, “Recent Advances in Electrical Neural Interface Engineering: Minimal Invasiveness, Longevity, and Scalability,” Neuron, vol. 108, no. 2, pp. 302–321, Oct. 2020.

M.-Y. Huang, T. Chi, S. Li, T.-Y. Huang, and H. Wang, “A 24.5–43.5-GHz Ultra-Compact CMOS Receiver Front End With Calibration-Free Instantaneous Full-Band Image Rejection for Multiband 5G Massive MIMO,” IEEE J. Solid-State Circuits (JSSC), vol. 55, no. 5, pp. 1177–1186, May 2020.

S. Li, T. Chi, D. Jung, T.-Y. Huang, M.-Y. Huang, and H. Wang, “An E-Band High-Linearity Antenna-LNA Front-End with 4.8dB NF and 2.2dBm IIP3 Exploiting Multi-Feed On-Antenna Noise-Canceling and Gm-Boosting,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2020, pp. 78–79.

J. S. Park, S. I. Grijalva, D. Jung, S. Li, G. V. Junek, T. Chi, H. C. Cho, and H. Wang, “Intracellular Cardiomyocytes Potential Recording by Planar Electrode Array and Fibroblasts Co-Culturing on Multi-Modal CMOS Chip,” Biosens. Bioelectron., vol. 144, Nov. 2019.

M.-Y. Huang, T. Chi, F. Wang, T.-W. Li, and H. Wang, “A Full-FoV Autonomous Hybrid Beamformer Array With Unknown Blockers Rejection and Signals Tracking for Low-Latency 5G mm-Wave Links,” IEEE Trans. Microw. Theory Techn. (T-MTT), vol. 67, no. 7, pp. 2964–2974, Jul. 2019.

M.-Y. Huang, T. Chi, F. Wang, S. Li, T.-Y. Huang, and H. Wang, “A 24.5-43.5GHz Compact RX with Calibration-Free 32-56dB Full-Frequency Instantaneously Wideband Image Rejection Supporting Multi-Gb/s 64-QAM/256-QAM for Multi-Band 5G Massive MIMO,” in Proc. IEEE Radio Freq. Integr. Circuits Symp. (RFIC), Jun. 2019, pp. 275–278.

S. Li, T. Chi, J.-S. Park, H. T. Nguyen, and H. Wang, “A 28-GHz Flip-Chip Packaged Chireix Transmitter With On-Antenna Outphasing Active Load Modulation,” IEEE J. Solid-State Circuits (JSSC), vol. 54, no. 5, pp. 1243–1253, May 2019.

S. Li, T. Chi, T.-Y. Huang, M.-Y. Huang, D. Jung, and H. Wang, “A Buffer-Less Wideband Frequency Doubler in 45-nm CMOS-SOI With Transistor Multiport Waveform Shaping Achieving 25% Drain Efficiency and 46–89 GHz Instantaneous Bandwidth,” IEEE Solid-State Circuits Lett. (SSCL), vol. 2, no. 4, pp. 25–28, Apr. 2019.

T. Chi, J. S. Park, S. Li, and H. Wang, “A Millimeter-Wave Polarization-Division-Duplex Transceiver Front-End With an On-Chip Multifeed Self-Interference-Canceling Antenna and an All-Passive Reconfigurable Canceller,” IEEE J. Solid-State Circuits (JSSC), vol. 53, no. 12, pp. 3628–3639, Dec. 2018.

H. T. Nguyen, T. Chi, S. Li, and H. Wang, “A Linear High-Efficiency Millimeter-Wave CMOS Doherty Radiator Leveraging Multi-Feed On-Antenna Active Load Modulation,” IEEE J. Solid-State Circuits (JSSC), vol. 53, no. 12, pp. 3587–3598, Dec. 2018.

E. T. Hardy, Y. J. Wang, S. Iyer, R. G. Mannino, Y. Sakurai, T. H. Barker, T. Chi, Y. Youn, H. Wang, A. C. Brown, and W. A. Lam, “Interdigitated microelectronic bandage augments hemostasis and clot formation at low applied voltage in vitro and in vivo,” Lab Chip, vol. 18, no. 19, pp. 2985–2993, Aug. 2018.

S. Li, T. Chi, H. T. Nguyen, T.-Y. Huang, and H. Wang, “A 28GHz Packaged Chireix Transmitter with Direct On-Antenna Outphasing Load Modulation Achieving 56%/38% PA Efficiency at Peak/6dB Back-Off Output Power,” in Proc. IEEE Radio Freq. Integr. Circuits Symp. (RFIC), Jun. 2018, pp. 68–71. ― 2018 IEEE RFIC Best Student Paper Award (2nd place)

S. Li, H. T. Nguyen, T. Chi, C. Li, N. Cahoon, A. Kumar, G. Freeman, D. Harame, and H. Wang, “Performance of V-Band On-Chip Antennas in GlobalFoundries 45nm CMOS SOI Process for Mm-Wave 5G Applications,” in Proc. IEEE MTT-S Int. Microw. Symp. (IMS), Jun. 2018, pp. 1593–1596.

J. S. Park, M. K. Aziz, S. Li, T. Chi, S. I. Grijalva, J. H. Sung, H. C. Cho, and H. Wang, “1024-Pixel CMOS Multimodality Joint Cellular Sensor/Stimulator Array for Real-Time Holistic Cellular Characterization and Cell-Based Drug Screening,” IEEE Trans. Biomed. Circuits Syst. (T-BioCAS), vol. 12, no. 1, pp. 80–94, Feb. 2018.

T. Chi, J. S. Park, S. Li, and H. Wang, “A 64GHz Full-Duplex Transceiver Front-End with An On-Chip Multifeed Self-Interference-Canceling Antenna and An All-Passive Canceler Supporting 4Gb/s Modulation in One Antenna Footprint,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2018, pp. 76–77.

H. T. Nguyen, T. Chi, S. Li, and H. Wang, “A 62-to-68GHz Linear 6Gb/s 64QAM CMOS Doherty Radiator with 27.5%/20.1% PAE at Peak/6dB-Back-Off Output Power Leveraging High-Efficiency Multi-Feed Antenna-Based Active Load Modulation,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2018, pp. 402–403.

M.-Y. Huang, T. Chi, F. Wang, T.-W. Li, and H. Wang, “A 23-to-30GHz Hybrid Beamforming MIMO Receiver Array with Closed-Loop Multistage Front-End Beamformers for Full-FoV Dynamic and Autonomous Unknown Signal Tracking and Blocker Rejection,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2018, pp. 68–69.

T. Chi, S. Li, J. S. Park, and H. Wang, “A Multifeed Antenna for High-Efficiency On-Antenna Power Combining,” IEEE Trans. Antennas Propag. (T-AP), vol. 65, no. 12, pp. 6937–6951, Dec. 2017.

S. Li, T. Chi, Y. Wang, and H. Wang, “A Millimeter-Wave Dual-Feed Square Loop Antenna for 5G Communications,” IEEE Trans. Antennas Propag. (T-AP), vol. 65, no. 12, pp. 6317–6328, Dec. 2017.

H. Wang, S. Hu, T. Chi, F. Wang, S. Li, M.-Y. Huang, and J. S. Park, “Towards Energy-Efficient 5G Mm-Wave Links: Exploiting Broadband Mm-Wave Doherty Power Amplifier and Multi-Feed Antenna with Direct On-Antenna Power Combining,” in Proc. IEEE Bipolar/BiCMOS Circuits Technol. Meeting (BCTM), Oct. 2017, pp. 30–37. ― Invited Paper

C. Li, M. Wang, T. Chi, A. Kumar, M. Boenke, D. Wang, N. Cahoon, A. Bandyopadhyay, A. Joseph, and H. Wang, “5G Mm-Wave Front-End-Module Design with Advanced SOI Process,” in Proc. IEEE Int. Conf. ASIC (ASICON), Oct. 2017, pp. 1017–1020.

M.-Y. Huang, T. Chi, F. Wang, and H. Wang, “An All-Passive Negative Feedback Network for Broadband and Wide Field-of-View Self-Steering Beam-Forming with Zero DC Power Consumption,” IEEE J. Solid-State Circuits (JSSC), vol. 52, no. 5, pp. 1260–1273, May 2017.

T. Chi, H. Wang, M.-Y. Huang, F. F. Dai, and H. Wang, “A Bidirectional Lens-Free Digital-Bits-In/-Out 0.57mm2 Terahertz Nano-Radio in CMOS with 49.3mW Peak Power Consumption Supporting 50cm Internet-of-Things Communication,” in Proc. IEEE Custom Integr. Circuits Conf. (CICC), Apr. 2017. ― 2017 IEEE CICC Best Paper Award

J. Park, M. K. Aziz, S. Gonzalez, D. Jung, T. Chi, S. Li, H. C. Cho, and H. Wang, “A CMOS 22k-Pixel Single-Cell Resolution Multi-Modality Real-Time Cellular Sensing Array,” in Proc. IEEE Custom Integr. Circuits Conf. (CICC), Apr. 2017.

T. Chi, F. Wang, S. Li, M.-Y. Huang, J. S. Park, and H. Wang, “A 60GHz On-Chip Linear Radiator with Single-Element 27.9dBm Psat and 33.1dBm Peak EIRP Using Multifeed Antenna for Direct On-Antenna Power Combining,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2017, pp. 296–297.

T. Chi, M.-Y. Huang, S. Li, and H. Wang, “A Packaged 90-to-300GHz Transmitter and 115-to-325GHz Coherent Receiver in CMOS for Full-Band Continuous-Wave Mm-Wave Hyperspectral Imaging,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2017, pp. 304–305.

M. Zia, T. Chi, J. S. Park, A. Su, J. L. Gonzalez, P. K. Jo, M. P. Styczynski, H. Wang, and M. S. Bakir, “3-D Integrated Electronic Microplate Platform for Low-Cost Repeatable Biosensing Applications,” IEEE Trans. Compon., Packag., Manuf. Technol. (T-CPMT), vol. 6, no. 12, pp. 1827–1833, Dec. 2016.

J. S. Park, M. K. Aziz, T. Chi, A. Su, A. Zhao, H. C. Cho, M. Styczynski, and H. Wang, “Live Demonstration: A 1024-Pixel CMOS Multi-Modality Sensing Array for Cell-Based Assays,” in Proc. IEEE SENSORS, Oct. 2016. ― 2016 IEEE SENSORS Best Live Demo Award (2nd Place)

S. Li, T. Chi, J. S. Park, and H. Wang, “A Multi-Feed Antenna for Antenna-Level Power Combining,” in Proc. IEEE Int. Symp. Antennas Propag. (AP-S/URSI), Jun. 2016, pp. 1589–1590.

J. S. Park, T. Chi, A. Su, C. Zhu, J. H. Sung, H. C. Cho, M. Styczynski, and H. Wang, “A High-Density CMOS Multi-Modality Joint Sensor/Stimulator Array with 1024 Pixels for Holistic Real-Time Cellular Characterization,” in Proc. IEEE Symp. VLSI Circuits (VLSI), Jun. 2016.

M.-Y. Huang, T. Chi, and H. Wang, “A 5GHz All-Passive Negative Feedback Network for RF Front-End Self-Steering Beam-Forming with Zero DC Power Consumption,” in Proc. IEEE Radio Freq. Integr. Circuits Symp. (RFIC), May 2016, pp. 91–94. ― 2016 IEEE RFIC Best Student Paper Award (2nd place)

S. Li, T. Chi, J. S. Park, W. T. Khan, H. Wang, and J. Papapolymerou, “A Fully Packaged D-Band MIMO Transmitter Using High-Density Flip-Chip Interconnects on A Flexible LCP Substrate,” in Proc. IEEE MTT-S Int. Microw. Symp. (IMS), May 2016.

T. Chi, J. S. Park, J. C. Butts, T. A. Hookway, A. Su, C. Zhu, M. P. Styczynski, T. C. McDevitt, and H. Wang, “A Multi-Modality CMOS Sensor Array for Cell-Based Assay and Drug Screening,” IEEE Trans. Biomed. Circuits Syst. (T-BioCAS), vol. 9, no. 6, pp. 801–814, Dec. 2015.

T. Chi and H. Wang, “A Scalable Active THz Frequency Multiplier Chain in Silicon with Multi-Phase Sub-Harmonic Injection Locking for Bandwidth Extension,” in Proc. Asia-Pacific Microw. Conf. (APMC), Dec. 2015. ― Invited Paper

M. Zia, T. Chi, C. Zhang, P. Thadesar, T. Hookway, J. Gonzalez, T. C. McDevitt, H. Wang, and M. S. Bakir, “A Microfabricated Electronic Microplate Platform for Low-cost Repeatable Biosensing Applications,” in Proc. IEEE Int. Electron Devices Meeting (IEDM), Dec. 2015.

M. Zia, C. Zhang, P. Thadesar, T. Hookway, T. Chi, J. Gonzalez, T. C. McDevitt, H. Wang, and M. S. Bakir, “Fabrication of and Cell Growth on ‘Silicon Membranes’ with High Density TSVs for Bio-Sensing Applications,” in Proc. IEEE Biomed. Circuits Syst. Conf. (BioCAS), Oct. 2015.

J. S. Park, T. Chi, A. Su, C. Zhu, J. Butts, T. Hookway, T. C. McDevitt, M. Styczynski, and H. Wang, “Live Demonstration: A Multi-Modality CMOS Sensor Array for Cell-Based Assay and Drug Screening,” in Proc. IEEE Biomed. Circuits Syst. Conf. (BioCAS), Oct. 2015.

T. Chi, J. Luo, S. Hu, and H. Wang, “A Multi-Phase Sub-Harmonic Injection Locking Technique for Bandwidth Extension in Silicon-Based THz Signal Generation,” IEEE J. Solid-State Circuits (JSSC), vol. 50, no. 8, pp. 1861–1873, Aug. 2015.

T. Chi, J. Papapolymerou, and H. Wang, “A +2.3dBm 124-158GHz Class-C Frequency Quadrupler with Folded-Transformer Based Multi-Phase Driving,” in Proc. IEEE Radio Freq. Integr. Circuits Symp. (RFIC), May 2015, pp. 263–266.

W. T. Khan, A. C. Ulusoy, R. Schmid, T. Chi, J. D. Cressler, H. Wang, and J. Papapolymerou, “A D-band (110 to 170 GHz) SPDT Switch in 32 nm CMOS SOI,” in Proc. IEEE MTT-S Int. Microw. Symp. (IMS), May 2015.

J. S. Park, T. Chi, J. Butts, T. Hookway, T. C. McDevitt, and H. Wang, “A Multimodality CMOS Sensor Array for Cell-Based Assay and Drug Screening,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2015, pp. 208–209.

H. Wang, A. Mahdavi, J. Park, T. Chi, J. Butts, T. A. Hookway, T. C. McDevitt, D. A. Tirrell, and A. Hajimiri, “Cell Culture and Cell Based Sensors on CMOS,” in Proc. IEEE Biomed. Circuits Syst. Conf. (BioCAS), Oct. 2014, pp. 468–471.

F. Inanlou, W. Khan, P. Song, S. Zeinolabedinzadeh, R. L. Schmid, T. Chi, A. C. Ulusoy, J. Papapolymerou, H. Wang, and J. D. Cressler, “Compact, Low-Power, Single-Ended and Differential SiGe W-band LNAs,” in Proc. Eur. Microw. Conf. (EuMC), Oct. 2014, pp. 1396–1399.

T. Chi, J. Luo, S. Hu, and H. Wang, “A Multi-Phase Sub-Harmonic Injection Locking Technique for Bandwidth Extension in Silicon-Based THz Signal Generation,” in Proc. IEEE Custom Integr. Circuits Conf. (CICC), Sep. 2014. ― 2014 IEEE CICC Best Student Paper Award Finalist

T. Chi, J. S. Park, R. L. Schmid, A. C. Ulusoy, J. D. Cressler, and H. Wang, “A Low-Power and Ultra-Compact W-band Transmitter Front-End in 90 nm SiGe BiCMOS Technology,” in Proc. IEEE Bipolar/BiCMOS Circuits Technol. Meeting (BCTM), Sep. 2014, pp. 155–158.

J. S. Park, T. Chi, and H. Wang, “An Ultra-Broadband Compact Mm-Wave Butler Matrix in CMOS for Array-Based MIMO Systems,” in Proc. IEEE Custom Integr. Circuits Conf. (CICC), Sep. 2013.