System Design: D-band Front-End Module
A key design challenge at sub-THz frequencies is to generate sufficiently high EIRP while maximizing DC-to-EIRP efficiency (ηEIRP). While significant progress has been made in improving single-element efficiency and developing large-scale phased arrays, we explore further gains in ηEIRP through a holistic antenna-IC-packaging co-design approach. By optimizing circuits, antennas, and packaging together, we expand the limited design space in the conventional TRX design flow and achieve >25-dBm single-element EIRP with >100% ηEIRP in the D band.